#include <linux/platform_device.h>
#include <linux/delay.h>
#include <linux/mtd/mtd.h>
+#include <linux/mtd/nand.h>
#include <linux/mtd/partitions.h>
#include <asm/hardware.h>
extern int omap_gpio_init(void);
-static struct mtd_partition h2_partitions[] = {
+static struct mtd_partition h2_nor_partitions[] = {
/* bootloader (U-Boot, etc) in first sector */
{
.name = "bootloader",
}
};
-static struct flash_platform_data h2_flash_data = {
+static struct flash_platform_data h2_nor_data = {
.map_name = "cfi_probe",
.width = 2,
- .parts = h2_partitions,
- .nr_parts = ARRAY_SIZE(h2_partitions),
+ .parts = h2_nor_partitions,
+ .nr_parts = ARRAY_SIZE(h2_nor_partitions),
};
-static struct resource h2_flash_resource = {
+static struct resource h2_nor_resource = {
/* This is on CS3, wherever it's mapped */
.flags = IORESOURCE_MEM,
};
-static struct platform_device h2_flash_device = {
+static struct platform_device h2_nor_device = {
.name = "omapflash",
.id = 0,
.dev = {
- .platform_data = &h2_flash_data,
+ .platform_data = &h2_nor_data,
},
.num_resources = 1,
- .resource = &h2_flash_resource,
+ .resource = &h2_nor_resource,
+};
+
+static struct mtd_partition h2_nand_partitions[] = {
+#if 0
+ /* REVISIT: enable these partitions if you make NAND BOOT
+ * work on your H2 (rev C or newer); published versions of
+ * x-load only support P2 and H3.
+ */
+ {
+ .name = "xloader",
+ .offset = 0,
+ .size = 64 * 1024,
+ .mask_flags = MTD_WRITEABLE, /* force read-only */
+ },
+ {
+ .name = "bootloader",
+ .offset = MTDPART_OFS_APPEND,
+ .size = 256 * 1024,
+ .mask_flags = MTD_WRITEABLE, /* force read-only */
+ },
+ {
+ .name = "params",
+ .offset = MTDPART_OFS_APPEND,
+ .size = 192 * 1024,
+ },
+ {
+ .name = "kernel",
+ .offset = MTDPART_OFS_APPEND,
+ .size = 2 * SZ_1M,
+ },
+#endif
+ {
+ .name = "filesystem",
+ .size = MTDPART_SIZ_FULL,
+ .offset = MTDPART_OFS_APPEND,
+ },
+};
+
+/* dip switches control NAND chip access: 8 bit, 16 bit, or neither */
+static struct nand_platform_data h2_nand_data = {
+ .options = NAND_SAMSUNG_LP_OPTIONS,
+ .parts = h2_nand_partitions,
+ .nr_parts = ARRAY_SIZE(h2_nand_partitions),
+};
+
+static struct resource h2_nand_resource = {
+ .flags = IORESOURCE_MEM,
+};
+
+static struct platform_device h2_nand_device = {
+ .name = "omapnand",
+ .id = 0,
+ .dev = {
+ .platform_data = &h2_nand_data,
+ },
+ .num_resources = 1,
+ .resource = &h2_nand_resource,
};
static struct resource h2_smc91x_resources[] = {
};
static struct platform_device *h2_devices[] __initdata = {
- &h2_flash_device,
+ &h2_nor_device,
+ &h2_nand_device,
&h2_smc91x_device,
};
{ OMAP_TAG_LCD, &h2_lcd_config },
};
+#define H2_NAND_RB_GPIO_PIN 62
+
+static int h2_nand_dev_ready(struct nand_platform_data *data)
+{
+ return omap_get_gpio_datain(H2_NAND_RB_GPIO_PIN);
+}
+
static void __init h2_init(void)
{
- /* NOTE: revC boards support NAND-boot, which can put NOR on CS2B
- * and NAND (either 16bit or 8bit) on CS3.
+ /* Here we assume the NOR boot config: NOR on CS3 (possibly swapped
+ * to address 0 by a dip switch), NAND on CS2B. The NAND driver will
+ * notice whether a NAND chip is enabled at probe time.
+ *
+ * FIXME revC boards (and H3) support NAND-boot, with a dip switch to
+ * put NOR on CS2B and NAND (which on H2 may be 16bit) on CS3. Try
+ * detecting that in code here, to avoid probing every possible flash
+ * configuration...
*/
- h2_flash_resource.end = h2_flash_resource.start = omap_cs3_phys();
- h2_flash_resource.end += SZ_32M - 1;
+ h2_nor_resource.end = h2_nor_resource.start = omap_cs3_phys();
+ h2_nor_resource.end += SZ_32M - 1;
+
+ h2_nand_resource.end = h2_nand_resource.start = OMAP_CS2B_PHYS;
+ h2_nand_resource.end += SZ_4K - 1;
+ if (!(omap_request_gpio(H2_NAND_RB_GPIO_PIN)))
+ h2_nand_data.dev_ready = h2_nand_dev_ready;
+
+ omap_cfg_reg(L3_1610_FLASH_CS2B_OE);
+ omap_cfg_reg(M8_1610_FLASH_CS2B_WE);
/* MMC: card detect and WP */
// omap_cfg_reg(U19_ARMIO1); /* CD */